Fatigue life prediction of solder joints in electronic packages with ANSYS

Fatigue life prediction of solder joints in electronic packages with ANSYS
Details
- OL Work ID
- OL5960331W
Subjects
ANSYS (Computer system)Computer-aided designElectronic packagingFatigueForecastingMetalsQuality controlService life (Engineering)Solder and solderingMetals, fatigue