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Fatigue life prediction of solder joints in electronic packages with ANSYSFatigue life prediction of solder joints in electronic packages with ANSYS

Fatigue life prediction of solder joints in electronic packages with ANSYS

Erdogan Madenci

Details

OL Work ID
OL5960331W

Subjects

ANSYS (Computer system)Computer-aided designElectronic packagingFatigueForecastingMetalsQuality controlService life (Engineering)Solder and solderingMetals, fatigue

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