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Application of fracture mechanics in electronic packaging

Application of fracture mechanics in electronic packaging1997

William T. Chen, D. T. Read

Details

First published
1997
OL Work ID
OL19223785W

Subjects

Multichip modules (Microelectronics)MaterialsCongressesFractureFracture mechanicsElectronic packaging

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Book data from Open Library. Cover images courtesy of Open Library.