Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Details
- OL Work ID
- OL25221682W
Subjects
Integrated circuitsThree-dimensional integrated circuitsCircuits intégrés tridimensionnelsTECHNOLOGY & ENGINEERINGMechanicalCOMPUTERSNetworkingGeneralTECHNOLOGYElectricityElectronicsCircuits