Lex

Browse

GenresShelvesPremiumBlog

Company

AboutJobsPartnersSell on LexAffiliates

Resources

DocsInvite FriendsFAQ

Legal

Terms of ServicePrivacy Policygeneral@lex-books.com(215) 703-8277

© 2026 LexBooks, Inc. All rights reserved.

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Yue Ma, Christian Gontrand

Details

OL Work ID
OL25221682W

Subjects

Integrated circuitsThree-dimensional integrated circuitsCircuits intégrés tridimensionnelsTECHNOLOGY & ENGINEERINGMechanicalCOMPUTERSNetworkingGeneralTECHNOLOGYElectricityElectronicsCircuits

Find this book

Open Library
Book data from Open Library. Cover images courtesy of Open Library.