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Manufacturing Challenges in Electronic Packaging

Manufacturing Challenges in Electronic Packaging

Y. C. Lee

About this book

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.

Details

ISBN-13
9781461558033
OL Work ID
OL19885629W

Subjects

EngineeringMachineryElectronic packagingManufacturing processes

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Open Library
Book data from Open Library. Cover images courtesy of Open Library.