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Throughsilicon Vias For 3d IntegrationThroughsilicon Vias For 3d Integration

Throughsilicon Vias For 3d Integration

John Lau

Details

OL Work ID
OL17490860W

Subjects

Integrated circuitsInterconnects (Integrated circuit technology)Three-dimensional integrated circuitsMicroelectronic packaging

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Book data from Open Library. Cover images courtesy of Open Library.