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Application of Fracture Mechanics in Electronic Packaging and MaterialsApplication of Fracture Mechanics in Electronic Packaging and Materials

Application of Fracture Mechanics in Electronic Packaging and Materials

Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta

Details

OL Work ID
OL8359641W

Subjects

CongressesFracture mechanicsElectronic packagingMechanical engineering

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