Materials, technology and reliability for advanced interconnects and low-k dielectrics

Materials, technology and reliability for advanced interconnects and low-k dielectrics2001
Details
- First published
- 2001
- OL Work ID
- OL12608488W
Subjects
CongressesIntegrated circuitsSemiconductorsMaterialsReliabilityDielectric filmsJunctionsMaterials, researchDielectrics